FIRST SEMESTER (Any Five of the following)
MIC 6101 Semiconductor Device physics.
MIC 6102 Integrated Circuit Technology.
MIC 6103 MOS Integrated Circuit Modeling.
MIC 6104 Computer Aided Design Methodologies and Tools.
MIC 6105 Hardware Description Languages and VLSI Design.
MIC 6106 Material Science & Engineering.
MIC 6107 Embedded System Design.
SECOND SEMESTER (Any Five of the following)
MIC 6201 Digital Integrated Circuits and Systems.
MIC 6202 Measurement and Characterization Techniques.
MIC 6203 Architecture of VLSI System.
MIC 6204 Analog and Mixed Signal Device Design.
MIC 6205 Advanced Memory Technology and Design.
MIC 6206 MEMS and Microsystems.
MIC 6207 RF and High Speed Digital Design.
THIRD SEMESTER (Any Two of the Following and Major Project)
MIC 7101 Low Power Digital CMOS Design
MIC 7102 Microelectronic Packaging and Testing
MIC 7103 Nano Scale Devices and Systems
MIC 7104 Major Project
FOURTH SEMESTER
MIC 7201 Major Project and Thesis
Student would be required to give seminar on the thesis topic. This would be given before the
Departmental Faculty and students of the department. The evaluation will be done by a board
consisting of supervisor, Chairman or his nominee and a member of faculty to be nominated by
Board of studies out of panel of 3 persons suggested by supervisor.
Thesis work will be based on research work conducted in the department of approved
research laboratory on the approved topic under the supervision of a faculty member of the
department. No numerical marks are to be assigned to thesis work. It is either “Accepted” or “Rejected”.
Quality of work reported in the thesis can be graded in terms of “Very Good”, “Good” or “Average”.
2
Note:
1) Theory papers will be of three hours duration.
2) Students will be required to attempt five questions out of eight questions for theory
paper.
3) Practical Examination will be of three hours duration.
EXAMINATION SCHEME
FIRST SEMESTER
Course Teaching Schedule of Examination
L P Total Theory Practical
External Internal External Internal
Course –I 3 2 5 75 25 30 20
Course –II 3 2 5 75 25 30 20
Course – III 3 2 5 75 25 30 20
Course – IV 3 2 5 75 25 30 20
Course – V 3 2 5 75 25 30 20
Total Marks: 750
SECOND SEMESTER
Course Teaching Schedule of Examination
L P Total Theory Practical
External Internal External Internal
Course –I 3 2 5 75 25 30 20
Course –II 3 2 5 75 25 30 20
Course – III 3 2 5 75 25 30 20
Course – IV 3 2 5 75 25 30 20
Course – V 3 2 5 75 25 30 20
Total Marks: 750
3
THIRD SEMESTER
Course Teaching Schedule of Examination
L P Total Theory Practical
External Internal External Internal
Course –I 3 2 5 75 25 30 20
Course –II 3 2 5 75 25 30 20
Thesis - 15 15 - - - 100
Total Marks: 400
FOURTH SEMESTER
Course Teaching Schedule of Examination
L P Total Theory Practical
External Internal External Internal
Thesis - 25 25 - - - 100
Total Marks: 100
Note: No numerical marks are to be assigned to External thesis work. It is either “Accepted” or
“Rejected”. Quality of work reported in the thesis can be graded in terms of “Very Good”, “Good” or
“Average”.
GRAND TOTAL: 2000
4
SYLLABUS
COURSE CONTENTS FOR M.TECH (MICRO-ELECTRONICS)
1st SEMESTER
MIC 6101: SEMICONDUCTOR DEVICE PHYSICS
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Review of Physics and properties of semiconductor, Bond and Bands, Electron Mass,
Mobility, continuity equation, charge transport
• p-n junction diode, bipolar transistor, Metal Semiconductor contacts, JFETs and
MOSFETs, MIS diode and CCD MOSFET and scaling effects.
• Photonic Devices, Hetero junction and Hetero structure devices, Introduction to Quantum
Physics.
References:
1. Device Electronics for Integrated circuits by Richard S.Muller Theodore I. Kamins,
John Wiley and Sons, 1986.
2. Fundamentals of Semi-Conductor Devices by Edward S. Yang. McGraw Hill, 1988.
3. Physics of Semi Conductor Devices by S.M. Sze, 1981
4. MOS Field Effect Transistor and Integrated Circuits by Paul Richaman, John Wiley
and Sons.
MIC 6102: INTEGRATED CIRCUIT TECHNOLOGY
NOTE: There will be eight questions in total and only five questions are to be
attempted.
• Crystal growth and wafer preparation, defects, clean room concept, wafer cleaning
techniques.
• Oxidation diffusion, Epitaxy, Ion Implantation, Metallization, Lithography, Etching.
• Typical Bipolar and MOS device fabrication techniques.
5
• Integration of unit processes, process modeling, IC Packaging, Reliability and failure
analysis.
References:
1. VLSI Technology, S.M.Sze, McGraw Hill.2001
2. Microchip Fabrication, Peter Van Zant, McGraw Hill.2002
3. Principles of growth and processing of Semiconductors, Subhash Mahajan, McGraw Hill.
1999.
4. The theory and practice of Microelectronics, Sorab K. Gandhi, John Willey & Sons. 2003
5. Silicon VLSI Technology, James D. Plummer and Michael D. Deal Pearson Education.
2001
6. Reliability Engineering for Electronic Design, Fuqua, Marcel Dekker.
Practical:
1. Introduction to process simulation tools, e.g. SUPREM, MINIMOS, STEPS etc.
2. Simulation of typical MOS processes and MOSFET Characteristics, extraction of
parameters for circuit simulation.
MIC 6103: MOS INTEGRATED CIRCUIT MODELLING
NOTE: There will be eight questions in total and only five questions are to be
attempted.
• Characteristics of MOS digital circuits, Inverters, NMOS NOR and NAND gate logic
circuits.
• CMOS Logic gates, transmission gates, signal propagation delays, Noise in Digital
logic circuits.
• Random Logic vs. standard logic forms, PLA Structured gate layout.
• Clocking systems, clocked CMOS logic, semiconductor memories.
• Microprocessor design, Device modeling, Circuit modeling.
6
References:
1. VLSI Design Techniques for Analog and Digital Circuits, Randall Geiger, McGraw
Hill.2000
2. Introduction to VLSI Systems, Mead and Convey, Addison Wesley. 1982
3. CMOS Digital Integrated Circuit Analysis and Design, Sung-Mo (Steve) Kang, McGraw
Hill.2002
4. Operation and Modeling of the MOS Transistor, Yannis TSIVIDIS, McGraw Hill
International Edition, 1999.
PRACTICALS
• Simulation using schematic editor
• Schematic page editor. Part editor, programmer’s editor,
• Session Log editing properties- spreadsheet editor property editor.
• Hierarchical design- Hierarchical blocks, ports, pins
• Placing, editing and connecting parts
• Editing and adding graphics
• Configuring a macro
• Creating a netlist
• Exporting and importing schematic data
• Analog stimuli-VSTIM, ISTIM
• Editing and creating models
• Digital simulation-Digital simuli DIGLOCK
• Simulation Parameters
• D.C Sweep Analysis
• Transient Analysis
• AC Sweep Analysis
• Parametric Analysis
• Performance Analysis
7
MIC 6104: COMPUTER AIDED DESIGN METHODOLOGIES AND TOOLS
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Introduction to VLSI design methodologies and supporting CAD tool environment.
Overview of C and Data structures, Graphics and CIF, concepts and structure and
algorithms for some of the CAD tools.
• Schematic editors, layout editors, Module generators, silicon compliers, placement
and routing tools.
• Behavioral, functional, logic and circuit simulators, Aids for test vector generation
and testing.
References:
1. Computer Aids for VLSI by Steven M. Rubin (Addison-Wesley) 1980
2. Algorithms for VLSI Design Automation, Sabin H.Gerez, John Wiley. 2000
3. An introduction to VLSI Physical design, Majid Serafzadeh, McGraw Hill.2002
4. Application specific integrated circuits, Michael John Sabastian, Smith Pearson
Education (LPE).2001
PRACTICAL
Study of
• schematic,
• layout editors,
• layout of gates, cells,
• layout optimization,
• use of silicon compliers.
MIC 6105: HARDWARE DESCRIPTION LANGUAGES AND VLSI DESIGN
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Design Environment, Design automation, role of EDA tools in design automation,
introduction to different EDA tools, simulation and synthesis issues.
8
• Design entry through schematic, Design simulation with SPICE, Designing with VHDLfeatures
and capabilities of VHDL, levels of abstraction and basic building blocks, modes
and language elements, behavior modeling, Data flow and structural modeling.
• VHDL description of combinational circuits, VHDL modeling of finite state machines,
PLD based system design- features of different CALD devices, physical downloading of
design on CPLD chip, FPGA chip.
References:
1. VHDL by Douglas Perry, Tata Mc Graw Hill 2004
2. VHDL Analysis & Modelling of Digital system by Navabi Z., Mc Graw Hill, 2002
3. VHDL for Designers by sjoholm and Lindh, Prentice Hall International,1998
4. Digital system Design using VHDL by Roth. C.H., Thomson learning,2000
MIC 6106: Material Science & Engineering
NOTE: There will be eight questions in total and only five questions are to be
attempted.
• Material Science: Atomic Bonding, Crystal structure and Defects, Diffusion, Mechanical
Behaviour, Thermal Behaviour, Failure Analysis & prevention.
• Phase Diagrams, Heat Treatment, Metals, Ceramics and Glasses, Polymers, Composites,
Electrical Behaviour, Optical behaviour, Semiconductor Materials, Magnetic Materials,
Environmental Degradation.
• Advanced Semiconductor Materials: Band structure, carrier concentration, Electrical
Mechanical and optical properties of Gallium Nitride, Aluminium Nitride, Indium
Nitride, Boron Nitride, Silicon Carbide, Silicon-germanium (Sil-xGex).
• Materials of special applications viz. cryogenic, high temperature, high frequency
applications.
References:
1. Properties of Advanced Semiconductor Materials: Gan, Aln, Inn, by Michael E
.Levinshtein, Springer. 2001
9
2. Introduction to Materials Science for Engineers, 6th Edition, By James F. Shackelford,
Prentice Hall.2001
3. Fundamentals of Semiconductors: Physics and Materials properties, By Yu and M
Cardona, Springer, 1996.
MIC 6107: EMBEDDED SYSTEM DESIGN
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Introduction: A system, processors and other hardware units for embedded systems,
embedded into system, regular processors and microcontrollers for embedded systems.
• Hardware Aspects: Brief discussion about processor structure, registers, memories,
parallel and serial communication and ports, timers and interrupts.
• Programming Tools and handheld Devices: Using embedded C++, use of RTOS μc/os-I
I, use of RTOS Vx Works, Kernel of an embedded system and device drivers.
• Using Multiple Processors in Embedded Systems: Multiple process in parallel, modeling
tools for a multiprocessor system, distributed embedded systems, Systems on chip(SOC).
• Design of an embedded system: System design, design cycle development phase for an
embedded system, users of target systems, emulator and ICE, use of software tools for
embedded systems, scopes and analyzers for system hardware tests.
References:
1. Embedded Systems, Raj Kamal, Tata Mcgraw Hill. 2004
2. Embedded System Design, Frank Vahid & Tony Givargis, John Wily & Sons.1998
3. Embedded System Design – An Introduction to Processes, Tools & Techniques,
Arnold S. Berger, CMP Books.2000
4. Real Time Systems, W.S. Liu Jane, Pearson Education.2003
5. Specification and Design Methodology for Real Time Embedded Systems, Janka S.
Randall, CMP Books.2000
10
2nd SEMESTER
MIC 6201: DIGITAL INTEGRATED CIRCUITS & SYSTEMS
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Noise Considerations in logic families.
• Digital system implementation using algorithmic state m/c concepts , Register transfer,
bus clocking and control, asynchronous and synchronous systems.
• High speed adders, multipliers, FIFOs, and Barrel shifters, ALU control semiconductors
for memories and PLAs, microprogrammed and PLA based control design.
• Data transfer techniques-examples of interface chips. Channel communication- protocols
and standard.
References:
1. Digital Circuits: A proportion for Microprocessors by Charles Mckay, Prentice Hall,
1994.
2. Physics of Semiconductor Devices by S. M. Sze.
3. Physics and Technology of Semiconductor Devices by A S Grove.
4. Digital Design: Principle and Practices by John F. Wakherly, PHI International, 1994.
MIC 6202: MEASUREMENT AND CHARACTERIZATION TECHNIQUES
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Measurement of Resistively, Film thickness, reflectivity, refractive-index, stress, line
width.
• Doping profile, Electron Beam Techniques (STM, AFM, TEM, SEM, electron beam
induced current (EBIC) and voltage contrast technique).
• AES, Electron Microphone (EDX), LEED, RHEED), Ion beam Techniques (SIMS,
RBS), X-ray techniques (XPS, X-ray Topography).
11
References:
1. Imperfections and Impurities in Semi conductor Silicon By K.V. Ravi, john Wiley and
Sons.
2. Characterization of Semi Conductor Materials by Philip F.Kare and Greydon B.Laubee,
Mc-Graw Hill.
3. Semi Conductor measurement and Instrumentation by W.R. Reunyan, McGraw Hill.
MIC 6203: ARCHITECTURE OF VLSI SYSTEMS
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Overview of architectural schemes, organization, representations and systems, single
processor design, mechanism for higher performance.
• CISC Vs RISC, memory organization, cache Memory, I/O subsystems and control unit
design, Algorithms.
• Specific architecture, upper computer architecture, pipeline and overlap processing, data
flow, systolic, distributed and paralleled architectures.
References:
1. Computer Architecture and organization, J.P hayes, Mc.Graw Hill. 1998
2. Computer Architecture, Nicholas Carter, Schaum’s outlines McGraw Hill.2001
3. Computer system organization and Architecture, Carpinellie, Pearson Education. 2001
4. Paralleled Algorithms for VLSI Computer Aided Design, Prithviraj Banerjee, PTR
Prentice Hall. 1992
MIC 6204: ANALOG AND MIXED SIGNAL DEVICE DESIGN
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Basic concepts, Bi CMOS and technology, current and voltage sources. Differential and
operational amplifiers, multiplexing and modulators, phase locked techniques.
12
• D to A and A to D converters, Microwave circuits, High voltage circuits, Filter design,
Current mirror, differential amplifier, theory and design of operational amplifiers,
common mode range.
• Design considerations for rail to rail inputs and output. MOS operational amplifier
timers, function generators, Multipliers and PLL.
References:
1. Digital Bipolar circuits by Mohammed I. Elmasy, John Wiley & Son
2. Analysis and Design of Analog Integrated circuits by Paul R. Gra and Robert G. Meyer,
John Wiley & sons. 1996.
PRACTICAL
• Simulation of analog integrated circuits
• Simulation & characterization of mixed signal devices
MIC 6205: ADVANCED MEMORY TECHNOLOGY AND DESIGN
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Basics of Memory, Advanced Semiconductor Memories, Memory Device and Process
Technology, Static Random Access Memory Technology.
• High –performance Dynamic random Access Memory, Non volatile memory, Radiation
effects, Ferroelectric memory, Flash Memory, Future trends.
• Basic Memory Architecture and Cell Structure, Application- Specific DRAM
Architectures and Design.
• Advanced Nonvolatile Memory Design and Technology, Embedded Memory Design
and Applications.
References:
1. Advanced Semiconductor Memories: Architectures, Designs, and Applications by Ashok
K. Sharma, 2002, Wiley-IEEE Press
13
2. Semiconductor Memories: Technology, Testing, and Reliability Ashok K. Sharma Wiley-
IEEE Press,2002
3. Semiconductor Memories: A handbook of Design, Manufacture and Application, 2nd
Edition by Betty Prince, Wiley- IEEE Press.
4. Ferroelectric Memories, James Scot, Springer publications.
5. Flash memories, edited by Paolo Cappelletti, Carla Golla, Piero Olivo, Enrico Zanoni,
Kluwer Academic Publishers, Boston.
6. Emerging memories, Technologies and Trends by Betty Prince, Kluwer Academic
Publishers.
MIC 6206: MEMS AND MICROSYSTEMS
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Overview, Working principle of microsensors & microactuation, Scaling laws in
geometry, electrostatic & electromagnetic forces, electricity, fluid mechanics and heat
transfer.
• Materials for MEMS, active substrate materials, polymers as MEMS materials.
Considerations for microfabrication, bulk micromanufacturing, surface micromachining,
LIGA process.
• Microsystem packaging, die-,devices-and system-level packaging, interfaces in
microsystem packaging for different applications, signal mapping and transduction.
• Microsystem design considerations, process design, mechanical design, mechanical
design using FEM, design considerations for optical, fluidic, RF and Bio-MEMS.
• Overview of CAD tools for MEMS design and simulation.
References:
1. MEMS & Microsystem- Design & Manufacture, Tai-Ran Hsu, Tata McGraw Hill.2002
2. Fundamentals of Microfabrication, Marc Madou, CRC press. 1990
3. Microsystem Design, Stephen Senturia, Kluwer Academic Publishers. 2000
14
4. An Introduction to Microelectromechanical System Engineering, Nadim Maluf, Artech
House. 1998
5. Microsensors MEMS and Smart Devices, Gardner and Varaden, John Wiley & Sons.
1995
MIC 6207: RF and High Speed Digital Design
NOTE: There will be eight questions in total and only five questions are to be attempted.
• High speed Design: ideal transmission line fundamentals, Crosstalk.
• Non Ideal interconnect issues, connectors packages and vias, Non ideal return paths,
simultaneous switching noise, and power delivery, buffer modeling, digital timing
analysis, timing specific design methodologies, radiated emissions compliance and
system noise minimization, high speed measurement techniques.
• RF Design: Introduction to RF Electronics, basic concepts in RF design, MOS Review,
Path Loss Small Signal Model, Receiver Design RF Transreceivers, Low Noise RF
amplifiers and Mixers, RF Power amplifiers, RF Oscillators.
References:
1. High- Speed Digital System Design by Stephen H.Hall. Springer.2001
2. Practical RF Circuit Design for Modern Wireless Systems, Volume I
: Passive Circuits and Systems by Les Besser, Rowan Gilmore
15
3rd SEMESTER
MIC 7101: LOW POWER DIGITAL CMOS DESIGN
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Hierarchy of limits of power.
• Sources of power consumption, power estimation, Synthesis for low power, Voltage
scaling approaches.
• Design and test of low power circuits, Adiabatic switching, Minimizing switched
capacitance.
• Low power static RAM architecture, Low energy computing using energy recovery
techniques, low power Programmable computation, Software design for low power.
References:
1. Low power CMOS VLSI Circuit Design, Kaushik Roy and Sharat Parsad, John Wiley
& Sons.1998
2. Low Power Digital CMOS Design, A.P. Chandrakasan and R Brodersen, Kluwer
Academic Publishers. 1995
3. Low Power Design Methodoligies, J.M. Rabaey and M. Pedram, KJ Academic
Publishers. 2001
4. Designing CMOS Circuits for Low Power, Dimitrios Soudris, Christian Piguet and
Costas Goutis, Kluwer Academic Publishers. 2000
MIC 7102: Microelectronics Packaging and Testing
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Packaging: Introduction, Packaging Hierarchy, Package parameters, packaging
substrates, package types, Hermetic packages, die attachment techniques, package
parasitic, package modeling, packaging in wireless application, future trends.
16
• Testing: Introduction, basic concepts, DFT, importance of test, boundary scan test,
boundary scan controller, faults, faults models, physical faults, stuck- at faults, logical
faults, CAD for stuck-at faults and path delays, IDDQ tests, fault collapsing, fault/
Automatic test pattern generation, Basic, ATPG algorithm, PODEM algorithm, Built- in
self test, LPSR, MISR.
References:
1. Microelectronics Packaging Handbook: Semiconductor Packaging Part I, II, III, R.R.
Tummals et. al., Kluwer Academic Publishers.
2. Circuits, Interconnects & Packaging for VLSI, H.B.Bakoglu, Addison Wesley.
3. Fundamentals of Microfabrication, Marc Madou, CRC Press. 1990
4. Digital Systems Testing and Testable design, Miron Abramovici, Melvin A. Breuer &
Arthur D. Friedman, Jaico publishing House. 2002
5. VLSI Fault Modeling and Testing Techniques, G.W.Zobrist, Albex Publishers. 1995.
6. Testing and Diagnosis of VLSI and ULSI, F. Lombardi and M. Sami, Kluwer
Academic Publishers. 1996.
7. Neural Models and Algorithms for Digital Testing, S.T. Chakradhar, U.D. Agrawal &
M.L Bushnell, Kluwer Academic Publishers. 1996.
8. Testing and Reliable Design of CMOS Circuits, N.K. Jha & S. Kurdu, Kluwer
Academic Publishers. 1996
MIC 7103: NANOSCALE DEVICES AND SYSTEMS
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Introduction, sub micron scaling, ballistic effects in MOS Devices, quantum transport
phenomenon, nanoscale modeling.
• Overview of Quantum Dots, Resonant tunneling devices (Diodes and transistors), Single
electron effects and Coulomb Blockade, Introduction to Nano electro mechanical systems
(NEMS).
17
• Introduction to Molecular electronic devices, self assembled monolayers (SAM), Diodes,
Optoelectronic Devices, Switches, Nanowires, programmable logic arrays, digital gates, flipflops,
shift registers, memories, rectifiers, Overview of nano materials.
• Nano Fabrication Techniques (Lithography, Self- Assemble, contact imprinting and Binding
of organics and semiconductors).
References:
1. Transport in Nanostructures, Ferry, David K. and Goodnick, Stephen Marshall
Cambridge University Press.
2. Nanotechnology: G. Timp, Bell Labs, Murray Hill, NJ (Ed.)
3. Molecular electronic devices, Part II, F.L. Carter, Forrest. L, Publisher: Marcel and
Dekker.
4. Nano Systems: Molecular machinery, manufacturing and computation: Eric Drexler.
Publisher: John Wiley and sons.
5. Organic electroluminescent materials and devices: S Miyata, H.S.Nalwa. Gordon and
breach science publishers, Amsterdam, 1997
6. Organic semiconductors: Felix Gutmann, Lawrence E lyons, John Wiley & Sons.
MAJOR PROJECT
Each student will be required to work on the major project approved by department
faculty that will span III and IV semesters during which periodic progress reports will be
monitored. At the end of III semester, project progress will be evaluated by the departmental
faculty.
At the end of IV semester, the student will submit the thesis based on his project work.
MIC 6101 Semiconductor Device physics.
MIC 6102 Integrated Circuit Technology.
MIC 6103 MOS Integrated Circuit Modeling.
MIC 6104 Computer Aided Design Methodologies and Tools.
MIC 6105 Hardware Description Languages and VLSI Design.
MIC 6106 Material Science & Engineering.
MIC 6107 Embedded System Design.
SECOND SEMESTER (Any Five of the following)
MIC 6201 Digital Integrated Circuits and Systems.
MIC 6202 Measurement and Characterization Techniques.
MIC 6203 Architecture of VLSI System.
MIC 6204 Analog and Mixed Signal Device Design.
MIC 6205 Advanced Memory Technology and Design.
MIC 6206 MEMS and Microsystems.
MIC 6207 RF and High Speed Digital Design.
THIRD SEMESTER (Any Two of the Following and Major Project)
MIC 7101 Low Power Digital CMOS Design
MIC 7102 Microelectronic Packaging and Testing
MIC 7103 Nano Scale Devices and Systems
MIC 7104 Major Project
FOURTH SEMESTER
MIC 7201 Major Project and Thesis
Student would be required to give seminar on the thesis topic. This would be given before the
Departmental Faculty and students of the department. The evaluation will be done by a board
consisting of supervisor, Chairman or his nominee and a member of faculty to be nominated by
Board of studies out of panel of 3 persons suggested by supervisor.
Thesis work will be based on research work conducted in the department of approved
research laboratory on the approved topic under the supervision of a faculty member of the
department. No numerical marks are to be assigned to thesis work. It is either “Accepted” or “Rejected”.
Quality of work reported in the thesis can be graded in terms of “Very Good”, “Good” or “Average”.
2
Note:
1) Theory papers will be of three hours duration.
2) Students will be required to attempt five questions out of eight questions for theory
paper.
3) Practical Examination will be of three hours duration.
EXAMINATION SCHEME
FIRST SEMESTER
Course Teaching Schedule of Examination
L P Total Theory Practical
External Internal External Internal
Course –I 3 2 5 75 25 30 20
Course –II 3 2 5 75 25 30 20
Course – III 3 2 5 75 25 30 20
Course – IV 3 2 5 75 25 30 20
Course – V 3 2 5 75 25 30 20
Total Marks: 750
SECOND SEMESTER
Course Teaching Schedule of Examination
L P Total Theory Practical
External Internal External Internal
Course –I 3 2 5 75 25 30 20
Course –II 3 2 5 75 25 30 20
Course – III 3 2 5 75 25 30 20
Course – IV 3 2 5 75 25 30 20
Course – V 3 2 5 75 25 30 20
Total Marks: 750
3
THIRD SEMESTER
Course Teaching Schedule of Examination
L P Total Theory Practical
External Internal External Internal
Course –I 3 2 5 75 25 30 20
Course –II 3 2 5 75 25 30 20
Thesis - 15 15 - - - 100
Total Marks: 400
FOURTH SEMESTER
Course Teaching Schedule of Examination
L P Total Theory Practical
External Internal External Internal
Thesis - 25 25 - - - 100
Total Marks: 100
Note: No numerical marks are to be assigned to External thesis work. It is either “Accepted” or
“Rejected”. Quality of work reported in the thesis can be graded in terms of “Very Good”, “Good” or
“Average”.
GRAND TOTAL: 2000
4
SYLLABUS
COURSE CONTENTS FOR M.TECH (MICRO-ELECTRONICS)
1st SEMESTER
MIC 6101: SEMICONDUCTOR DEVICE PHYSICS
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Review of Physics and properties of semiconductor, Bond and Bands, Electron Mass,
Mobility, continuity equation, charge transport
• p-n junction diode, bipolar transistor, Metal Semiconductor contacts, JFETs and
MOSFETs, MIS diode and CCD MOSFET and scaling effects.
• Photonic Devices, Hetero junction and Hetero structure devices, Introduction to Quantum
Physics.
References:
1. Device Electronics for Integrated circuits by Richard S.Muller Theodore I. Kamins,
John Wiley and Sons, 1986.
2. Fundamentals of Semi-Conductor Devices by Edward S. Yang. McGraw Hill, 1988.
3. Physics of Semi Conductor Devices by S.M. Sze, 1981
4. MOS Field Effect Transistor and Integrated Circuits by Paul Richaman, John Wiley
and Sons.
MIC 6102: INTEGRATED CIRCUIT TECHNOLOGY
NOTE: There will be eight questions in total and only five questions are to be
attempted.
• Crystal growth and wafer preparation, defects, clean room concept, wafer cleaning
techniques.
• Oxidation diffusion, Epitaxy, Ion Implantation, Metallization, Lithography, Etching.
• Typical Bipolar and MOS device fabrication techniques.
5
• Integration of unit processes, process modeling, IC Packaging, Reliability and failure
analysis.
References:
1. VLSI Technology, S.M.Sze, McGraw Hill.2001
2. Microchip Fabrication, Peter Van Zant, McGraw Hill.2002
3. Principles of growth and processing of Semiconductors, Subhash Mahajan, McGraw Hill.
1999.
4. The theory and practice of Microelectronics, Sorab K. Gandhi, John Willey & Sons. 2003
5. Silicon VLSI Technology, James D. Plummer and Michael D. Deal Pearson Education.
2001
6. Reliability Engineering for Electronic Design, Fuqua, Marcel Dekker.
Practical:
1. Introduction to process simulation tools, e.g. SUPREM, MINIMOS, STEPS etc.
2. Simulation of typical MOS processes and MOSFET Characteristics, extraction of
parameters for circuit simulation.
MIC 6103: MOS INTEGRATED CIRCUIT MODELLING
NOTE: There will be eight questions in total and only five questions are to be
attempted.
• Characteristics of MOS digital circuits, Inverters, NMOS NOR and NAND gate logic
circuits.
• CMOS Logic gates, transmission gates, signal propagation delays, Noise in Digital
logic circuits.
• Random Logic vs. standard logic forms, PLA Structured gate layout.
• Clocking systems, clocked CMOS logic, semiconductor memories.
• Microprocessor design, Device modeling, Circuit modeling.
6
References:
1. VLSI Design Techniques for Analog and Digital Circuits, Randall Geiger, McGraw
Hill.2000
2. Introduction to VLSI Systems, Mead and Convey, Addison Wesley. 1982
3. CMOS Digital Integrated Circuit Analysis and Design, Sung-Mo (Steve) Kang, McGraw
Hill.2002
4. Operation and Modeling of the MOS Transistor, Yannis TSIVIDIS, McGraw Hill
International Edition, 1999.
PRACTICALS
• Simulation using schematic editor
• Schematic page editor. Part editor, programmer’s editor,
• Session Log editing properties- spreadsheet editor property editor.
• Hierarchical design- Hierarchical blocks, ports, pins
• Placing, editing and connecting parts
• Editing and adding graphics
• Configuring a macro
• Creating a netlist
• Exporting and importing schematic data
• Analog stimuli-VSTIM, ISTIM
• Editing and creating models
• Digital simulation-Digital simuli DIGLOCK
• Simulation Parameters
• D.C Sweep Analysis
• Transient Analysis
• AC Sweep Analysis
• Parametric Analysis
• Performance Analysis
7
MIC 6104: COMPUTER AIDED DESIGN METHODOLOGIES AND TOOLS
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Introduction to VLSI design methodologies and supporting CAD tool environment.
Overview of C and Data structures, Graphics and CIF, concepts and structure and
algorithms for some of the CAD tools.
• Schematic editors, layout editors, Module generators, silicon compliers, placement
and routing tools.
• Behavioral, functional, logic and circuit simulators, Aids for test vector generation
and testing.
References:
1. Computer Aids for VLSI by Steven M. Rubin (Addison-Wesley) 1980
2. Algorithms for VLSI Design Automation, Sabin H.Gerez, John Wiley. 2000
3. An introduction to VLSI Physical design, Majid Serafzadeh, McGraw Hill.2002
4. Application specific integrated circuits, Michael John Sabastian, Smith Pearson
Education (LPE).2001
PRACTICAL
Study of
• schematic,
• layout editors,
• layout of gates, cells,
• layout optimization,
• use of silicon compliers.
MIC 6105: HARDWARE DESCRIPTION LANGUAGES AND VLSI DESIGN
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Design Environment, Design automation, role of EDA tools in design automation,
introduction to different EDA tools, simulation and synthesis issues.
8
• Design entry through schematic, Design simulation with SPICE, Designing with VHDLfeatures
and capabilities of VHDL, levels of abstraction and basic building blocks, modes
and language elements, behavior modeling, Data flow and structural modeling.
• VHDL description of combinational circuits, VHDL modeling of finite state machines,
PLD based system design- features of different CALD devices, physical downloading of
design on CPLD chip, FPGA chip.
References:
1. VHDL by Douglas Perry, Tata Mc Graw Hill 2004
2. VHDL Analysis & Modelling of Digital system by Navabi Z., Mc Graw Hill, 2002
3. VHDL for Designers by sjoholm and Lindh, Prentice Hall International,1998
4. Digital system Design using VHDL by Roth. C.H., Thomson learning,2000
MIC 6106: Material Science & Engineering
NOTE: There will be eight questions in total and only five questions are to be
attempted.
• Material Science: Atomic Bonding, Crystal structure and Defects, Diffusion, Mechanical
Behaviour, Thermal Behaviour, Failure Analysis & prevention.
• Phase Diagrams, Heat Treatment, Metals, Ceramics and Glasses, Polymers, Composites,
Electrical Behaviour, Optical behaviour, Semiconductor Materials, Magnetic Materials,
Environmental Degradation.
• Advanced Semiconductor Materials: Band structure, carrier concentration, Electrical
Mechanical and optical properties of Gallium Nitride, Aluminium Nitride, Indium
Nitride, Boron Nitride, Silicon Carbide, Silicon-germanium (Sil-xGex).
• Materials of special applications viz. cryogenic, high temperature, high frequency
applications.
References:
1. Properties of Advanced Semiconductor Materials: Gan, Aln, Inn, by Michael E
.Levinshtein, Springer. 2001
9
2. Introduction to Materials Science for Engineers, 6th Edition, By James F. Shackelford,
Prentice Hall.2001
3. Fundamentals of Semiconductors: Physics and Materials properties, By Yu and M
Cardona, Springer, 1996.
MIC 6107: EMBEDDED SYSTEM DESIGN
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Introduction: A system, processors and other hardware units for embedded systems,
embedded into system, regular processors and microcontrollers for embedded systems.
• Hardware Aspects: Brief discussion about processor structure, registers, memories,
parallel and serial communication and ports, timers and interrupts.
• Programming Tools and handheld Devices: Using embedded C++, use of RTOS μc/os-I
I, use of RTOS Vx Works, Kernel of an embedded system and device drivers.
• Using Multiple Processors in Embedded Systems: Multiple process in parallel, modeling
tools for a multiprocessor system, distributed embedded systems, Systems on chip(SOC).
• Design of an embedded system: System design, design cycle development phase for an
embedded system, users of target systems, emulator and ICE, use of software tools for
embedded systems, scopes and analyzers for system hardware tests.
References:
1. Embedded Systems, Raj Kamal, Tata Mcgraw Hill. 2004
2. Embedded System Design, Frank Vahid & Tony Givargis, John Wily & Sons.1998
3. Embedded System Design – An Introduction to Processes, Tools & Techniques,
Arnold S. Berger, CMP Books.2000
4. Real Time Systems, W.S. Liu Jane, Pearson Education.2003
5. Specification and Design Methodology for Real Time Embedded Systems, Janka S.
Randall, CMP Books.2000
10
2nd SEMESTER
MIC 6201: DIGITAL INTEGRATED CIRCUITS & SYSTEMS
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Noise Considerations in logic families.
• Digital system implementation using algorithmic state m/c concepts , Register transfer,
bus clocking and control, asynchronous and synchronous systems.
• High speed adders, multipliers, FIFOs, and Barrel shifters, ALU control semiconductors
for memories and PLAs, microprogrammed and PLA based control design.
• Data transfer techniques-examples of interface chips. Channel communication- protocols
and standard.
References:
1. Digital Circuits: A proportion for Microprocessors by Charles Mckay, Prentice Hall,
1994.
2. Physics of Semiconductor Devices by S. M. Sze.
3. Physics and Technology of Semiconductor Devices by A S Grove.
4. Digital Design: Principle and Practices by John F. Wakherly, PHI International, 1994.
MIC 6202: MEASUREMENT AND CHARACTERIZATION TECHNIQUES
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Measurement of Resistively, Film thickness, reflectivity, refractive-index, stress, line
width.
• Doping profile, Electron Beam Techniques (STM, AFM, TEM, SEM, electron beam
induced current (EBIC) and voltage contrast technique).
• AES, Electron Microphone (EDX), LEED, RHEED), Ion beam Techniques (SIMS,
RBS), X-ray techniques (XPS, X-ray Topography).
11
References:
1. Imperfections and Impurities in Semi conductor Silicon By K.V. Ravi, john Wiley and
Sons.
2. Characterization of Semi Conductor Materials by Philip F.Kare and Greydon B.Laubee,
Mc-Graw Hill.
3. Semi Conductor measurement and Instrumentation by W.R. Reunyan, McGraw Hill.
MIC 6203: ARCHITECTURE OF VLSI SYSTEMS
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Overview of architectural schemes, organization, representations and systems, single
processor design, mechanism for higher performance.
• CISC Vs RISC, memory organization, cache Memory, I/O subsystems and control unit
design, Algorithms.
• Specific architecture, upper computer architecture, pipeline and overlap processing, data
flow, systolic, distributed and paralleled architectures.
References:
1. Computer Architecture and organization, J.P hayes, Mc.Graw Hill. 1998
2. Computer Architecture, Nicholas Carter, Schaum’s outlines McGraw Hill.2001
3. Computer system organization and Architecture, Carpinellie, Pearson Education. 2001
4. Paralleled Algorithms for VLSI Computer Aided Design, Prithviraj Banerjee, PTR
Prentice Hall. 1992
MIC 6204: ANALOG AND MIXED SIGNAL DEVICE DESIGN
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Basic concepts, Bi CMOS and technology, current and voltage sources. Differential and
operational amplifiers, multiplexing and modulators, phase locked techniques.
12
• D to A and A to D converters, Microwave circuits, High voltage circuits, Filter design,
Current mirror, differential amplifier, theory and design of operational amplifiers,
common mode range.
• Design considerations for rail to rail inputs and output. MOS operational amplifier
timers, function generators, Multipliers and PLL.
References:
1. Digital Bipolar circuits by Mohammed I. Elmasy, John Wiley & Son
2. Analysis and Design of Analog Integrated circuits by Paul R. Gra and Robert G. Meyer,
John Wiley & sons. 1996.
PRACTICAL
• Simulation of analog integrated circuits
• Simulation & characterization of mixed signal devices
MIC 6205: ADVANCED MEMORY TECHNOLOGY AND DESIGN
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Basics of Memory, Advanced Semiconductor Memories, Memory Device and Process
Technology, Static Random Access Memory Technology.
• High –performance Dynamic random Access Memory, Non volatile memory, Radiation
effects, Ferroelectric memory, Flash Memory, Future trends.
• Basic Memory Architecture and Cell Structure, Application- Specific DRAM
Architectures and Design.
• Advanced Nonvolatile Memory Design and Technology, Embedded Memory Design
and Applications.
References:
1. Advanced Semiconductor Memories: Architectures, Designs, and Applications by Ashok
K. Sharma, 2002, Wiley-IEEE Press
13
2. Semiconductor Memories: Technology, Testing, and Reliability Ashok K. Sharma Wiley-
IEEE Press,2002
3. Semiconductor Memories: A handbook of Design, Manufacture and Application, 2nd
Edition by Betty Prince, Wiley- IEEE Press.
4. Ferroelectric Memories, James Scot, Springer publications.
5. Flash memories, edited by Paolo Cappelletti, Carla Golla, Piero Olivo, Enrico Zanoni,
Kluwer Academic Publishers, Boston.
6. Emerging memories, Technologies and Trends by Betty Prince, Kluwer Academic
Publishers.
MIC 6206: MEMS AND MICROSYSTEMS
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Overview, Working principle of microsensors & microactuation, Scaling laws in
geometry, electrostatic & electromagnetic forces, electricity, fluid mechanics and heat
transfer.
• Materials for MEMS, active substrate materials, polymers as MEMS materials.
Considerations for microfabrication, bulk micromanufacturing, surface micromachining,
LIGA process.
• Microsystem packaging, die-,devices-and system-level packaging, interfaces in
microsystem packaging for different applications, signal mapping and transduction.
• Microsystem design considerations, process design, mechanical design, mechanical
design using FEM, design considerations for optical, fluidic, RF and Bio-MEMS.
• Overview of CAD tools for MEMS design and simulation.
References:
1. MEMS & Microsystem- Design & Manufacture, Tai-Ran Hsu, Tata McGraw Hill.2002
2. Fundamentals of Microfabrication, Marc Madou, CRC press. 1990
3. Microsystem Design, Stephen Senturia, Kluwer Academic Publishers. 2000
14
4. An Introduction to Microelectromechanical System Engineering, Nadim Maluf, Artech
House. 1998
5. Microsensors MEMS and Smart Devices, Gardner and Varaden, John Wiley & Sons.
1995
MIC 6207: RF and High Speed Digital Design
NOTE: There will be eight questions in total and only five questions are to be attempted.
• High speed Design: ideal transmission line fundamentals, Crosstalk.
• Non Ideal interconnect issues, connectors packages and vias, Non ideal return paths,
simultaneous switching noise, and power delivery, buffer modeling, digital timing
analysis, timing specific design methodologies, radiated emissions compliance and
system noise minimization, high speed measurement techniques.
• RF Design: Introduction to RF Electronics, basic concepts in RF design, MOS Review,
Path Loss Small Signal Model, Receiver Design RF Transreceivers, Low Noise RF
amplifiers and Mixers, RF Power amplifiers, RF Oscillators.
References:
1. High- Speed Digital System Design by Stephen H.Hall. Springer.2001
2. Practical RF Circuit Design for Modern Wireless Systems, Volume I
: Passive Circuits and Systems by Les Besser, Rowan Gilmore
15
3rd SEMESTER
MIC 7101: LOW POWER DIGITAL CMOS DESIGN
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Hierarchy of limits of power.
• Sources of power consumption, power estimation, Synthesis for low power, Voltage
scaling approaches.
• Design and test of low power circuits, Adiabatic switching, Minimizing switched
capacitance.
• Low power static RAM architecture, Low energy computing using energy recovery
techniques, low power Programmable computation, Software design for low power.
References:
1. Low power CMOS VLSI Circuit Design, Kaushik Roy and Sharat Parsad, John Wiley
& Sons.1998
2. Low Power Digital CMOS Design, A.P. Chandrakasan and R Brodersen, Kluwer
Academic Publishers. 1995
3. Low Power Design Methodoligies, J.M. Rabaey and M. Pedram, KJ Academic
Publishers. 2001
4. Designing CMOS Circuits for Low Power, Dimitrios Soudris, Christian Piguet and
Costas Goutis, Kluwer Academic Publishers. 2000
MIC 7102: Microelectronics Packaging and Testing
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Packaging: Introduction, Packaging Hierarchy, Package parameters, packaging
substrates, package types, Hermetic packages, die attachment techniques, package
parasitic, package modeling, packaging in wireless application, future trends.
16
• Testing: Introduction, basic concepts, DFT, importance of test, boundary scan test,
boundary scan controller, faults, faults models, physical faults, stuck- at faults, logical
faults, CAD for stuck-at faults and path delays, IDDQ tests, fault collapsing, fault/
Automatic test pattern generation, Basic, ATPG algorithm, PODEM algorithm, Built- in
self test, LPSR, MISR.
References:
1. Microelectronics Packaging Handbook: Semiconductor Packaging Part I, II, III, R.R.
Tummals et. al., Kluwer Academic Publishers.
2. Circuits, Interconnects & Packaging for VLSI, H.B.Bakoglu, Addison Wesley.
3. Fundamentals of Microfabrication, Marc Madou, CRC Press. 1990
4. Digital Systems Testing and Testable design, Miron Abramovici, Melvin A. Breuer &
Arthur D. Friedman, Jaico publishing House. 2002
5. VLSI Fault Modeling and Testing Techniques, G.W.Zobrist, Albex Publishers. 1995.
6. Testing and Diagnosis of VLSI and ULSI, F. Lombardi and M. Sami, Kluwer
Academic Publishers. 1996.
7. Neural Models and Algorithms for Digital Testing, S.T. Chakradhar, U.D. Agrawal &
M.L Bushnell, Kluwer Academic Publishers. 1996.
8. Testing and Reliable Design of CMOS Circuits, N.K. Jha & S. Kurdu, Kluwer
Academic Publishers. 1996
MIC 7103: NANOSCALE DEVICES AND SYSTEMS
NOTE: There will be eight questions in total and only five questions are to be attempted.
• Introduction, sub micron scaling, ballistic effects in MOS Devices, quantum transport
phenomenon, nanoscale modeling.
• Overview of Quantum Dots, Resonant tunneling devices (Diodes and transistors), Single
electron effects and Coulomb Blockade, Introduction to Nano electro mechanical systems
(NEMS).
17
• Introduction to Molecular electronic devices, self assembled monolayers (SAM), Diodes,
Optoelectronic Devices, Switches, Nanowires, programmable logic arrays, digital gates, flipflops,
shift registers, memories, rectifiers, Overview of nano materials.
• Nano Fabrication Techniques (Lithography, Self- Assemble, contact imprinting and Binding
of organics and semiconductors).
References:
1. Transport in Nanostructures, Ferry, David K. and Goodnick, Stephen Marshall
Cambridge University Press.
2. Nanotechnology: G. Timp, Bell Labs, Murray Hill, NJ (Ed.)
3. Molecular electronic devices, Part II, F.L. Carter, Forrest. L, Publisher: Marcel and
Dekker.
4. Nano Systems: Molecular machinery, manufacturing and computation: Eric Drexler.
Publisher: John Wiley and sons.
5. Organic electroluminescent materials and devices: S Miyata, H.S.Nalwa. Gordon and
breach science publishers, Amsterdam, 1997
6. Organic semiconductors: Felix Gutmann, Lawrence E lyons, John Wiley & Sons.
MAJOR PROJECT
Each student will be required to work on the major project approved by department
faculty that will span III and IV semesters during which periodic progress reports will be
monitored. At the end of III semester, project progress will be evaluated by the departmental
faculty.
At the end of IV semester, the student will submit the thesis based on his project work.
